Project Onboarding
Review chipset, BOM, thermal requirements, and manufacturability before production.
Manufacturing
SMT, DIP, AOI, aging and stress testing in one production flow.
Confirm manufacturing capability, equipment coverage, quality checkpoints, and production scale before opening a sourcing conversation.
01PCB Design
Engineering review for chipset, BOM, layout, and thermal requirements.
02SMT
Surface-mount production with in-line process checkpoints.
03DIP
Through-hole assembly, soldering, and batch-level production control.
04AOI
Automated optical inspection for soldering and placement defects.
05Aging Test
Reliability, stress, and functional validation before shipment.
Line Coordination
SMT, DIP, AOI, and functional testing connect through controlled checkpoints.
Reliability Review
Aging, stress tests, final inspection, and packing checks complete before release.